描述

1. A low temperature lead-free solder paste customized for high-end motherboard repair.

2.Strong viscosity. The paste is fine and the particles are fine, only 20~38 microns.

3.Excellent wettability, the surface is still wet after 36 hours of opening, and does not affect the welding.

4.Strong welding ability, high resistance, strong activity, bright and full tin.

5.The storage time is long, and the storage time in the refrigerated environment is over 12 months, which is not easy to dry.