MECHANIC Lead-Free BGA Solder Paste Flux Low High Temperature Soldering Tin Cream Welding Flux Paste for BGA Rework Station

描述

Specification:
–Brand : MECHANIC
–Type : Lead-Free Solder Tin Paste
–Weight : 20g/35g/40g/42g/60g
–Low Temperature Melting Point : 138℃
–High Temperature Melting Point : 217℃
–Great Soldering Rework Tools for Smart Phone, PCB, BGA, Motherboard Repairing.